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术语
bonding pad
释义
bonding pad
焊接区;[结合片]
A metallic area on the surface of a chip for a wire connection.
一种为引线连接而在芯片表面设置的金属区。
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summing junction
superbar
supercomputer
superconducting amplifier
superconductivity
superencipherment
supergroup
supergroup distribution frame
superheterodyne
superheterodyne reception
super high frequency
superimpose
superimposed circuit
super large scale integration (SLSI)
super master group
superpose
superposed ringing
superscalar
superscript
superscript character (SPS)
supervising system
supervision
logon mode table
logon request
logo screen
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更新时间:2025/2/10 22:04:20