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术语
bonding pad
释义
bonding pad
焊接区;[结合片]
A metallic area on the surface of a chip for a wire connection.
一种为引线连接而在芯片表面设置的金属区。
随便看
power of a number
power of merge
power pack
power problems
power residue method
power restart
Powers code
power semiconductor device
power supply
power typing
power up
powerfailure interrupt
powersupply circuit
powersupply efficiency
pragmatics
PRC
preallocated control block stack
preamble
preassembly
prebinding
precedence
precedence prosignz
precedence rule
precision
precoded form
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更新时间:2025/3/13 2:16:00